CPU天梯图 2024 Intel CPU 挤牙膏进度 2008-2024 显卡天梯图 笔记本CPU天梯图 笔记本显卡天梯图 固态硬盘天梯图 硬盘天梯图 2024
Qualcomm Snapdragon 8 Gen 3 CPU天梯图 单核 性能 参数 多核 跑分 排名
cpu插槽类型大全 至强cpu天梯图
| 内容 | |
| 型号 | Qualcomm Snapdragon 8 Gen 3 |
| GeekBench6 单核跑分 | 2197 |
| GeekBench6 多核跑分 | 7325 |
| 安兔兔跑分 | 1969433 |
| productNames | Xiaomi 14 Pro, Xiaomi Redmi K70 Pro, Vivo X100 Pro Plus |
| 发布时间 | 2023 |
| 品牌 | Qualcomm |
| 是否有 核显 | 带有核显 |
| GPU核显 | Adreno 750 |
| 类型 | Mobile/Embedded |
| 最主频GHz | 3.3 |
| 总核心 | 8 |
| L3缓存 | 12288 KB |
| nm | 4 |
| 4g | LTE Cat. 24 |
| 5g | Yes |
| wifi | 7 |
| bluetooth | 5.4 |
| videoCodecs | H.264, H.265, AV1, VP8, VP9 |
| navigation | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC |
| modem | Snapdragon X75 |
| 支持主板 | ARMv9.2-A |
| CPU介绍 | Qualcomm Snapdragon 8 Gen 3 – an 8-core chipset that was announced on October 24, 2023, and is manufactured using a 4-nanometer process technology. It has 1 core Cortex-X4 at 3300 MHz, 3 cores Cortex-A720 at 3150 MHz, 2 cores Cortex-A720 at 2960 MHz, and 2 cores Cortex-A520 at 2260 MHz. |
| viewCount | 586 |
| 创建时间 | 2023-12-10 05:37:31 |
| 修改时间 | 2024-11-21 14:03:28 |
打开 哈希空间 微信小程序中查看更佳