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CPU天梯图 2024 Intel CPU 挤牙膏进度 2008-2024 显卡天梯图笔记本CPU天梯图笔记本显卡天梯图固态硬盘天梯图硬盘天梯图 2024

Qualcomm Technologies, Inc SDM630 CPU天梯图单核性能参数多核跑分排名

cpu插槽类型大全 至强cpu天梯图

	内容
型号	Qualcomm Technologies, Inc SDM630
单核性能跑分	608
发布时间	2021
单核性能对比 Intel i9-13900KF	13%
多核性能对比 Intel i9-13900KF	3%
多核评分	1846
类型	Mobile/Embedded
最主频GHz	2.2
总核心	8
总线程数	8
单核性能相当于	2009 AMD Sempron LE-1300 2008 Intel Pentium E2140 @ 1.60GHz
多核性能相当于	2009 AMD Opteron 2378 2013 AMD A8-5550M APU 2023 Rockchip RK3399 EVB IND LPDDR4 Board lvds (Android 2014 Intel Core M-5Y70 @ 1.10GHz 2010 AMD Athlon II X3 455 2012 AMD A6-3620 APU 2015 Intel Core i3-4110U @ 1.90GHz 2018 Intel Core i5-4230U @ 1.90GHz 2013 Intel Pentium 1403 @ 2.60GHz 2021 ARM Cortex-A53 6 Core 1896 MHz 2018 Intel Celeron G3900TE @ 2.30GHz 2021 Intel Core i3-4100E @ 2.40GHz 2012 Intel Core i3-2310E @ 2.10GHz 2012 AMD Phenom II X3 B77 2011 Intel Core i3-2100 @ 3.10GHz 2014 Intel Xeon X3323 @ 2.50GHz 2021 MT6765V/WB 2019 AMD A6-7480 2022 Intel Atom x6211E @ 1.30GHz 2021 MediaTek MT6765V/CB 2009 Intel Core2 Quad Q8300 @ 2.50GHz
摘要	Description: Class: Mobile/Embedded Socket: Clockspeed: 2.2 GHz Cores: 8 Threads: 8 Other names: Qualcomm Technologies, Inc SDM630 CPU First Seen on Charts: Q1 2021 CPUmark/$Price: NA Overall Rank: 2431 Last Price Change: NA
markId	3983
viewCount	204
创建时间	2022-11-05 16:39:47
修改时间	2024-05-02 23:03:48

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